New York, United States, Jan. 25, 2024 (GLOBE NEWSWIRE) — The Global SiC Wafer Polishing Market Size to Grow from USD 4.2 Billion in 2022 to USD 5.6 Billion by 2032, at a Compound Annual Growth Rate (CAGR) of 6.7% during the forecast period.
The basic raw material, silicon carbide (SiC), is utilised to begin the value chain. The extraction or synthesis of SiC powder is required. Sublimation or the modified Lely technique are then used to shape SiC powder into ingots or boules. These ingots are sliced into wafers using diamond wire saws or other cutting procedures. Wafers are lapped and ground to get the desired thickness and flatness. This is when the SiC wafer polishing comes into play. Chemical mechanical polishing (CMP) is a popular technique for removing surface flaws. After polishing, wafers are completely cleaned to remove any polishing residue. Inspection techniques ensure that quality standards are met.Determine the sectors and applications that are driving the demand for SiC wafers. Frequently included are power electronics, automobiles, telephones, and renewable energy. Examine the opportunities afforded by advancements in polishing technology. Innovations that boost productivity, reduce costs, or improve the quality of polished wafers can be potent motivators. Look at new and upcoming applications for SiC wafers. As technology progresses, SiC wafers may find applications outside of traditional semiconductor manufacturing. Examine the possibility for market expansion in various regions. As more industries adopt SiC technology, there may be untapped markets with increased demand. Analyse the supply chain to identify potential weaknesses and opportunities for improvement. The ability to maintain a resilient and efficient supply chain may be vital to market success.Diamond slurries segment accounted for the largest market share over the forecast period 2023 to 2032. The tremendous hardness of diamond particles is well recognised. The use of diamond slurries as polishing abrasives enables for more efficient material removal from SiC wafers, resulting in a smoother, more uniform surface. Diamond slurries aid in improving the surface quality of SiC wafers. Diamond abrasives remove surface defects and scratches, hence enhancing the overall quality of polished wafers. Diamond slurries are regularly modified by manufacturers to meet specific polishing requirements. Because of this flexibility, the polishing process can be adjusted based on factors such as particle size, concentration, and carrier fluid.Power Electronics segment accounted for the largest market share over the forecast period 2023 to 2032. SiC wafer utilisation in power electronics is being driven by increased demand for high-power electronic devices, notably in sectors such as electric vehicles, renewable energy, and industrial automation. The automobile industry’s shift towards electric vehicles (EVs) and hybrid electric vehicles (HEVs) is a significant factor. SiC wafers are essential in the development of EV power electronics, resulting in the growth of the power electronics sector. SiC-based power electronics are widely used in renewable energy applications such as solar inverters and wind turbines. The increased emphasis on clean energy solutions is driving demand for SiC wafers in power electronics.This study forecasts revenue at global, regional, and country levels from 2023 to 2032.
(GlobeNewsWire)