New York, Jan. 12, 2024 (GLOBE NEWSWIRE) — Looking ahead from 2023 to 2033, the Semiconductor Assembly Test Services Market is poised for growth. Starting at a valuation of US$ 33,533.2 Mn in 2022, it is expected to reach US$ 35,109.3 Mn in 2023 and eventually soar to US$ 64,879.0 Mn by 2033, with a steady compound annual growth rate (CAGR) of 6.3% throughout the forecast period. The semiconductor assembly and testing services, often known as packaging and testing, play a crucial role in the semiconductor manufacturing process. Leading service providers are making substantial investments in advanced equipment and processes to facilitate the testing of wafers and components, along with offering cutting-edge packaging solutions driven by research. Due to the significant expenses involved in assembly and testing services, many companies opt for outsourcing.
Teerth Technospace, Unit B-704
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(GlobeNewsWire)