Diamond Slurry SiC Wafer Polishing Centrifuges Lead Growth in Global SiC Wafer Polishing Market with 37.5% CAGR to 2028

Dublin, Sept. 14, 2023 (GLOBE NEWSWIRE) — The “Global SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application, Process, & Region (North America, Europe, APAC, South America, MEA) – Forecast 2028” report has been added to ResearchAndMarkets.com’sResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
(GlobeNewsWire)